Freescale claimed that they have made a ‘breakthrough‘ in integrated circuit packaging. The Redistributed Chip Packaging method allowed making component, which contains all electronics for a 3G phone in a single package of 25×25 millimeter.



Freescale Semiconductor also unveiled another innovation, which can replace BGA and flip chip as the dominant packaging and approach for advanced integrated semiconductors.



Redistributed Chip Packaging offers flexibility and integrated density, which delivers 30 per cent small packaged semiconductors solutions versus traditional BGA technology.



RCP integrates semiconductor packaging as the functional part of the system solution. 3G mobile phones and large number of consumers easily adapt RCP technology. They can take benefit from consolidation of electronic components into single system. It is compatible with advanced technology such as System in Package, Package on Package and integrated cavity packages.



Company is expecting that product would be available by 2008 in the market. They are intending to use RCP in highly integrated wireless product families.



Via: 3G Co